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Strained SiGe Channels for Band-Edge PMOS Threshold Voltages With Metal Gates and High- $k$ Dielectrics
24
Citations
15
References
2010
Year
Materials ScienceSemiconductorsElectrical EngineeringSige ChannelsMetal GateLow P-channel Metal-oxide-semiconductorEngineeringSemiconductor TechnologyStress-induced Leakage CurrentOxide SemiconductorsApplied PhysicsTime-dependent Dielectric BreakdownSemiconductor MaterialSilicon On InsulatorMicroelectronicsGate-first Integration TechnologyMetal GatesSemiconductor Device
Achieving low p-channel metal-oxide-semiconductor (PMOS) threshold voltages with metal gates and high- <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">k</i> dielectrics is challenging with conventional gate-first complimentary metal-oxide-semiconductor process integration. This study, for the first time, explores the tradeoffs in using different combinations of thin-strained Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">1 -</sub> <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</i> Ge <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</i> channels, boron counterdopings, Si capping layers, and different metal-gate electrodes to obtain low PMOS threshold voltages with metal gate on high- <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">k</i> dielectrics in a gate-first integration technology. Device simulations are used to explain the experimental threshold voltage trends with varying Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">1 -</sub> <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</i> Ge <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</i> thicknesses, boron counterdopings, and gate work functions.
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