IEEE Electron Device Letters · 2008 · 37 citations · 15 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsComplementary Metal-oxide-semiconductor TechnologyField-effect TransistorsMetal-oxide-semiconductor Field-effect TransistorsSemiconductor Device MaterialsSemiconductor Thin FilmsShort-channel EffectsChannel Doping EffectsSeries ResistanceSeries Resistance CompensationSilicon-on-insulator CmosSilicon-on-insulator ProcessingSilicon-on-insulator Technology
We have fabricated undoped-body short-channel extremely thin silicon-on-insulator (ETSOI) field-effect transistors (FETs) with 8-nm SOI thickness that exhibit the expected short-channel benefit compared with doped partially depleted SOI (PDSOI) FETs. Using a source/drain extension (SDE) last process with the SDE implants activated with diffusionless laser anneal, we demonstrate that the series resistance penalty can be minimized, which leads to ETSOI FET drive currents that are comparable to those of conventional thick-body PDSOI FETs.
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Scaling theory for double-gate SOI MOSFET's
Ken Suzuki, Tetsu Tanaka, Y. Tosaka et al. · IEEE Transactions on Electron Devices · 1993 · 556 citations · Full text
Engineering, Electrical Engineering, Electronic Materials +16
Silicon CMOS devices beyond scaling
Wilfried Haensch, E. Nowak, R.H. Dennard et al. · IBM Journal of Research and Development · 2006 · 455 citations
Engineering, Computer Engineering, Electrical Engineering +17