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Defect structure of epitaxial GaN films determined by transmission electron microscopy and triple-axis X-ray diffractometry
547
Citations
21
References
1998
Year
Materials ScienceDislocation DensitiesElectrical EngineeringWide-bandgap SemiconductorEngineeringDislocation InteractionCrystalline DefectsTransmission Electron MicroscopyApplied PhysicsAluminum Gallium NitrideEpitaxial Gan FilmsGan Power DeviceGan Films ExhibitEpitaxial GrowthDefect StructureVertical Correlation LengthMicrostructure
Abstract Important structural characteristics (correlation lengths of columnar crystallites, dislocation densities, angles of rotational disorder) of hexagonal GaN grown by metallorganic chemical vapour deposition on c-plane sapphire are determined by transmission electron microscopy and triple-axis X-ray diffractometry. GaN films exhibit an edge dislocation density in the range of 1011 cm−2, a tilt and twist angle of 0.1° and 1.3° and a columnar structure with a lateral and vertical correlation length of 150 and 1000 nm respectively. The determination of correlation lengths and dislocation densites from X-ray patterns was undertaken using two independent evaluation methods which are discussed in detail. It is also shown that triple-axis X-ray diffractometry is a highly suitable technique for the separation of different kinds of structural defects such as edge and screw dislocations that lead to a characteristic broadening of symmetric and asymmetric Bragg reflections. The correlation lengths and dislocation densities are obtained additionally by electron transmission microscope investigations which are in good agreement with the X-ray diffraction results.
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