IEEE Transactions on Electron Devices · 1988 · 158 citations · 4 references
Natural SciencesMaterials EngineeringMaterials ScienceMechanical Behavior Of MaterialsSemiconductor DevicesThin FilmsNanomechanicsStrain AnalysisStrain EngineeringStress-strain BehaviorThin Film Mechanical PropertiesThin Film StrainFilm StrainMechanical Properties Of FilmsPolysiliconStress Engineering In Thin FilmsStress MeasurementTensile StrainThin Film Mechanics
Novel processing conditions and strain diagnostic structures are used to demonstrate that polysilicon films with built-in tensile-strain can be achieved and that any physical size limitations due to compressive-buckling in polysilicon micromechanical structures can be eliminated.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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