High Al-content AlGaN/GaN MODFETs for ultrahigh performance

Abstract

The use of an AlGaN layer with high Al mole-fraction is proposed to increase the equivalent figures of merit of the AlGaN/GaN MODFET structure. It is shown that the room temperature mobility has little degradation with increasing Al mole-fraction up to 50%. 0.7-μm gate-length Al/sub 0.5/Ga/sub 0.5/N/GaN MODFETs by optical lithography exhibit a current density of 1 A/mm and three-terminal breakdown voltages up to 200 V. These devices on sapphire substrates without thermal management also show CW power densities of 2.84 and 2.57 W/mm at 8 and 10 GHz, respectively, representing a marked performance improvement for GaN-based FETs."