Re-Examining The Physical Basis of Pattern Density and Step Height CMP Models

Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing

B.E. Stine, Dennis O. Ouma, R. Divecha et al. · IEEE Transactions on Semiconductor Manufacturing · 1998 · 139 citations

Engineering, Electrical Engineering, Materials Science +16

Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts

Dennis O. Ouma, Duane S. Boning, J.E. Chung et al. · IEEE Transactions on Semiconductor Manufacturing · 2002 · 136 citations

Engineering, Electrical Engineering, Materials Science +17

Wear‐Contact Problems and Modeling of Chemical Mechanical Polishing

O. G. Chekina, L. M. Keer, Hongyu Liang · Journal of The Electrochemical Society · 1998 · 127 citations

Engineering, Materials Engineering, Materials Science +16

Modeling of Pattern Dependencies for Multi-Level Copper Chemical-Mechanical Polishing Processes

Tamba Tugbawa, Tae Park, Brian Lee et al. · MRS Proceedings · 2001 · 31 citations

Engineering, Materials Engineering, Materials Science +14

A Contact-Mechanics Based Model for Dishing and Erosion in Chemical-Mechanical Polishing

Joost J. Vlassak · MRS Proceedings · 2001 · 19 citations

Engineering, Materials Engineering, Materials Science +12