IEEE Electron Device Letters · 1989 · 25 citations · 8 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsHigh-frequency Semiconductor DevicesIii-v SemiconductorsSemiconductor Device MaterialsSemiconductor HeterostructuresSemiconductor InterfacesSemiconductor PhysicsBand AlignmentContact FormationGallium NitrideHeterojunction Bipolar TransistorsReactive Ion EtchingSelective EtchingSelf-aligned StructuresSemiconductor Materials For Microwave Devices
A self-alignment technique for AlGaAs/GaAs heterojunction bipolar transistors (HBTs) using refractory metal film, W, as the emitter and base electrodes is presented. A nonalloyed contact formation combined with selective reactive ion etching of W or WSi/sub x/ against GaAs and SiO/sub 2/ produces a self-aligned structure. An emitter contact that is thermally stable is obtained by using a Zn diffusion process to make the extrinsic base contact layer. An f/sub T/ value as high as 82 GHz was obtained. The self-alignment technique combined with the Zn diffusion process will achieve a much higher f/sub T/ if a thinner base HBT structure is used.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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<i>I</i> <i>n</i> <i>s</i> <i>i</i> <i>t</i> <i>u</i> contacts to GaAs based on InAs
S. L. Wright, R. F. Marks, S. Tiwari et al. · Applied Physics Letters · 1986 · 61 citations