Concepedia
Electrochimica Acta · 2004 · 50 citations · 21 references
Materials ScienceElectrometallurgyChemical EngineeringEngineeringSurface ElectrochemistryCatalysisElectrode Reaction MechanismElectrochemistryElectrochemical Aspects
21
Chemical processes in the chemical mechanical polishing of copper
Joseph M. Steigerwald, S. P. Murarka, R.J. Gutmann et al. · Materials Chemistry and Physics · 1995 · 195 citations
Materials Science, Chemical Engineering, Engineering +7
Surface Chemistry Studies of Copper Chemical Mechanical Planarization
J. M. Hernandez, P. Wrschka, G. S. Oehrlein · Journal of The Electrochemical Society · 2001 · 188 citations
Engineering, Chemistry, Electrometallurgy +19
Modification of the Preston equation for the chemical–mechanical polishing of copper
Qiuliang Luo, S. Ramarajan, S. V. Babu · Thin Solid Films · 1998 · 167 citations
Materials Science, Materials Engineering, Chemical Engineering +8
The Role of Glycine in the Chemical Mechanical Planarization of Copper
Serdar Aksu, Fiona M. Doyle · Journal of The Electrochemical Society · 2002 · 129 citations
Materials Science, Copper Cmp, Chemical Engineering +11
Effect of Hydrogen Peroxide on Oxidation of Copper in CMP Slurries Containing Glycine
Serdar Aksu, Ling Wang, Fiona M. Doyle · Journal of The Electrochemical Society · 2003 · 98 citations · Full text
Engineering, Chemistry, Mineral Processing +16