Publication | Closed Access
Technology Scaling Comparison of Flip-Flop Heavy-Ion Single-Event Upset Cross Sections
52
Citations
20
References
2013
Year
EngineeringVlsi DesignNuclear PhysicsComputer ArchitectureIon Beam InstrumentationPhysical Design (Electronics)Heavy Ion PhysicAdvanced Packaging (Semiconductors)Ion BeamElectronic PackagingIon EmissionElectrical EngineeringAccelerator Mass SpectrometryComputer EngineeringSingle Event EffectsSingle-event Upset TrendsMicroelectronicsExperimental ResultsExperimental Nuclear PhysicsHeavy-ion Experimental Results
Heavy-ion experimental results from flip-flops in 180-nm to 28-nm bulk technologies are used to quantify single-event upset trends. The results show that as technologies scale, D flip-flop single-event upset cross sections decrease while redundant storage node flip-flops cross sections may stay the same or increase depending on the layout spacing of storage nodes. As technology feature sizes become smaller, D flip-flop single-event upset cross sections approach redundant storage node hardened flip-flops cross sections for particles with high linear energy transfer values. Experimental results show that redundant storage node designs provide <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex Notation="TeX">$> 100{\rm X}$</tex></formula> improvement in single-event upset cross section over DFF for ion linear energy transfer values below <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex Notation="TeX">$10~\hbox{MeV-cm}^2/\hbox{mg}$</tex></formula> down to 28-nm feature sizes.
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