IEEE Electron Device Letters · 2011 · 86 citations · 10 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice ScalingElectron TransportHigh-frequency Semiconductor DevicesIii-v SemiconductorsSemiconductor PhysicsWide-bandgap Semiconductor DevicesCurrent DensityDevice Scaling EffectsGallium NitrideGallium Nitride (Gan) MaterialsGan-based High-frequency DevicesSource-drain EngineeringSurface Current Density
In this letter, we report the first experimental observation of electron velocity enhancement by aggressive lateral scaling of GaN HEMTs. Through reduction of the source-drain distance down to 170 nm using <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">n</i> <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> -GaN ohmic regrowth, 45-nm gate AlN/GaN/Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.08</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.92</sub> N HEMTs exhibited an extremely small on resistance of 0.44 Ω·mm , a high maximum drain current density of 2.3 A/mm, a high peak extrinsic transconductance of 905 mS/mm, and a record <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">fT</i> / <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">f</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> of 260/394 GHz. Delay time analysis showed that the outstanding <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">fT</i> was mainly due to significantly reduced electron transit time at higher drain-source voltages resulting from suppressed drain delay and enhanced electron velocity in the laterally scaled GaN HEMTs.
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Haifeng Sun, Andreas R. Alt, H. Benedickter et al. · IEEE Electron Device Letters · 2010 · 152 citations · Full text