2006 · 17 citations · 4 references
EngineeringBioengineeringElectrical EngineeringEmbedded SystemsNeural EngineeringSensorsBiomedical SensorsBrain-computer InterfacesElectroencephalographic MonitoringElectroencephalographySensor IntegrationSensor Interfacing3D Integrated CircuitsActivity MonitoringCrystal OscillatorsElectroencephalography InstrumentationElectroencephalography-based Brain-computer InterfacesSystem-in-package IntegrationThree-dimensional IntegrationWireless Sensor Node Design
This paper presents details of a 3D-SIP approach. It involves a package-on-package system level integration method that leads to a 3D stack where the different layers are individual sub-system SIP circuit blocks. By using this approach, the required number of connections between the SIP packages is greatly reduced. A SIP also offers sufficient 3D-interconnect density between the functional layers. Using a 3D SIP approach of integration, a wireless bio-electronic sensor node was realized. This system includes a low-power radio, a matched antenna, a microcontroller with a 12 bit ADC, crystal oscillators, all necessary passives and a custom designed EEG ASIC. The currently demonstrated device is a portable, electroencephalogram (EEG) system for brain activity monitoring
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Flip chip assembly challenges using high density, thin core carriers
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