Moody Dreiza

High Density PoP (Package-on-Package) and Package Stacking Development

Moody Dreiza, Akito Yoshida, Kazuo Ishibashi et al. · 2007 · 61 citations

Engineering, Computer Engineering, Embedded Systems +13

Application of through mold via (TMV) as PoP base package

Jinseong Kim, Kiwook Lee, Dongjoo Park et al. · 2008 · 54 citations

Engineering, Computer Engineering, Digital Fabrication +13

Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level Underfill

Joonyeob Lee, Tae-Kyung Hwang, Jin‐Young Kim et al. · 2007 · 39 citations

Engineering, Systems Engineering, Condition Assessment +10

Joint project for mechanical qualification of next generation high density package-on-package (PoP) with through mold via technology

Moody Dreiza, Jin Seong Kim, Lee Smith · 2009 · 11 citations

Agriculture, Materials Engineering, Microelectromechanical Systems +15