Akito Yoshida - Concepedia

Author

Akito Yoshida

Also Known As

A Yoshida, A. Yoshida, Akito Yoshida, Yoshida, Akito

Publications

306

Citations

H-Index

Concepts

All Affiliations

Akito Yoshida is an author at Amkor Technology (United States) specializing in engineering, electronic packaging, and computer engineering.

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	268
2	Computer Engineering	5	5	201
3	Electrical Engineering	3	3	88
4	Health Sciences	1	1	13
5	Applied Physics	1	1	54

Akito Yoshida

Publications

268

Citations

H-Index

Page 1

	Year	Citations
A Study on Package Stacking Process for Package-on-Package (PoP) Akito Yoshida, Jun Taniguchi, K. Murata, Software MaintenanceEngineeringPackage StackingComputer ArchitectureSoftware Engineering	2006	93
High Density PoP (Package-on-Package) and Package Stacking Development Moody Dreiza, Akito Yoshida, Kazuo Ishibashi, Software MaintenanceEngineeringTop Package DippingComputer ArchitectureSoftware Engineering	2007	61
Discontinuity of G.P.(I) zone and θ′-phase in an Al-Cu alloy M. Takeda, Yasuhiro Maeda, Akito Yoshida, Scripta Materialia Materials ScienceMaterials EngineeringEngineeringAl-cu AlloyPhysics	1999	54
A study on an Ultra Thin PoP using through mold via technology Akito Yoshida, Shengmin Wen, Wei Lin, Mold ControlEngineeringMechanical EngineeringBottom PackageMolding (Process)	2011	20
Design and stacking of an extremely thin chip-scale package Akito Yoshida, Kazuo Ishibashi 3D Ic ArchitectureElectrical EngineeringThin Chip-scale PackagePackage DesignEngineering	2004	16
Evaluation of raw substrate variation from different suppliers and processes and their impact on package warpage Wei Lin, Shengmin Wen, Akito Yoshida, EngineeringFood PackagingIndustrial EngineeringPackage WarpageAdvanced Packaging (Semiconductors)	2012	13
Advanced Embedded Packaging for Power Devices Naoki Hayashi, Miki Nakashima, Hiroshi Demachi, EngineeringPower DevicesPower ElectronicsEmbedded DiesAdvanced Packaging (Semiconductors)	2017	11

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