Akito Yoshida

A Study on Package Stacking Process for Package-on-Package (PoP)

Akito Yoshida, Jun Taniguchi, K. Murata et al. · 2006 · 93 citations

Software Maintenance, Engineering, Package Stacking +23

High Density PoP (Package-on-Package) and Package Stacking Development

Moody Dreiza, Akito Yoshida, Kazuo Ishibashi et al. · 2007 · 61 citations

Software Maintenance, Engineering, Top Package Dipping +18

Discontinuity of G.P.(I) zone and θ′-phase in an Al-Cu alloy

M. Takeda, Yasuhiro Maeda, Akito Yoshida et al. · Scripta Materialia · 1999 · 54 citations

Materials Science, Materials Engineering, Engineering +8

A study on an Ultra Thin PoP using through mold via technology

Akito Yoshida, Shengmin Wen, Wei Lin et al. · 2011 · 20 citations

Mold Control, Engineering, Mechanical Engineering +20

Design and stacking of an extremely thin chip-scale package

Akito Yoshida, Kazuo Ishibashi · 2004 · 16 citations

3D Ic Architecture, Electrical Engineering, Thin Chip-scale Package +14