Concepedia

Shengmin Wen

SW

Statistics

Publications

4

Citations

94

H-Index

4

Active since

2001

Affiliations

Northwestern University(Current)

Amkor Technology (United States)

Shengmin Wen is an author at Northwestern University specializing in materials engineering, warpage, and engineering.

Publications per year

2001–2012

4

Publications

4

Constitutive and damage model for a lead-free solder

Shengmin Wen, L. M. Keer, H. Mavoori · Journal of Electronic Materials · 2001 · 36 citations

Engineering, Materials Engineering, Materials Science +6

A constitutive model for a high lead solder

Shengmin Wen, L.A. Keer, Semyon Vaynman et al. · IEEE Transactions on Components and Packaging Technologies · 2002 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +17

A study on an Ultra Thin PoP using through mold via technology

Akito Yoshida, Shengmin Wen, Wei Lin et al. · 2011 · 20 citations

Engineering, Materials Engineering, Microfabrication +11

Evaluation of raw substrate variation from different suppliers and processes and their impact on package warpage

Wei Lin, Shengmin Wen, Akito Yoshida et al. · 2012 · 13 citations

Agriculture, Manufacturing Engineering, Materials Engineering +12

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