Concepedia
Microelectronic Engineering · 2009 · 18 citations · 3 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsPackaging DesignSemiconductor DevicesChip PackagingPackaging EngineeringFlip-chip BondingFlip-chip BumpingFlip-chip PackagingSolderingSoldering Joints
3
Tin–lead (SnPb) solder reaction in flip chip technology
K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 589 citations
Engineering, Materials Engineering, Materials Science +10
Advanced copper electroplating for application of electronics
Shuhei Miura, Hideo HONMA · Surface and Coatings Technology · 2003 · 112 citations
Natural Sciences, Materials Engineering, Materials Science +12
Pb‐free solder bumping for flip chip package by electroplating
Hyeon Jun Hwang, Soon‐Min Hong, Jae Pil Jung et al. · Soldering and Surface Mount Technology · 2003 · 14 citations
Natural Sciences, Materials Engineering, Materials Science +14