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Low V<inf>f</inf> and highly reliable 16 kV ultrahigh voltage SiC flip-type n-channel implantation and epitaxial IGBT
32
Citations
9
References
2013
Year
Unknown Venue
EngineeringMosfet StructurePower Electronic SystemsEpitaxial IgbtPower ElectronicsSemiconductor Device4H-sic Carbon FaceHigh Voltage EngineeringFlip-type N-channel ImplantationPower SemiconductorsLow VPower Electronic DevicesSemiconductor TechnologyElectrical EngineeringPower Semiconductor DeviceSemiconductor Device FabricationMicroelectronicsPower DeviceApplied PhysicsReliable 16
Flip-type n-channel implantation and epitaxial (IE)-IGBT on 4H-SiC carbon face with an epitaxial p <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">++</sup> collector layer was investigated. In this study, we employed the IEMOSFET as a MOSFET structure with original wet gate oxidation method, to realize high channel mobility. We were able to achieve an ultrahigh blocking voltage of more than 16 kV, extremely low forward voltage drop of 5 V at 100 A/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and small threshold voltage shift (<; 0.1 V). These characteristics are useful for Smart Grid and HVDC systems, the use of which would realize a low carbon emission society.
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