Surface activation for low temperature wafer fusion bonding by radicals produced in an oxygen discharge

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A. Manz, N. Graber, H.M. Widmer · Sensors and Actuators B Chemical · 1990 · 3.1K citations

Natural Sciences, Chemical Engineering, Chemistry +16

Bonding of silicon wafers for silicon-on-insulator

W. Maszara, Georges Goetz, A.L. Caviglia et al. · Journal of Applied Physics · 1988 · 861 citations

Engineering, Materials Engineering, Materials Science +17

Ozone in Indoor Environments: Concentration and Chemistry

Charles J. Weschler · Indoor Air · 2000 · 748 citations

Natural Sciences, Chemistry, Environmental Sciences +16

Chemical Free Room Temperature Wafer To Wafer Direct Bonding

Shari Farrens, James Dekker, Jason Kenneth Smith et al. · Journal of The Electrochemical Society · 1995 · 146 citations

Engineering, Materials Engineering, Materials Science +14

Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method

Hideki Takagi, Ryutaro Maeda, Teak Ryong Chung et al. · Sensors and Actuators A Physical · 1998 · 114 citations

Engineering, Materials Engineering, Materials Science +13