Japanese Journal of Applied Physics · 2013 · 16 citations · 21 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsDopingEpitaxial GrowthSemiconductor Device MaterialsSemiconductor HeterostructuresSemiconductor InterfacesSemiconductor SurfacesGallium Nitride (Gan) MaterialsHeterostructure DevicesHydride Vapor Phase EpitaxyImpuritiesOhmic ConductionOhmic ContactsOhmic MaterialsSecondary Ion Mass Spectrometry
We report on accumulation of background Si and O impurities measured by secondary ion mass spectrometry (SIMS) at the sub-interfaces in undoped, Zn- and Mg-doped multi-layer GaN structures grown by hydride vapor phase epitaxy (HVPE) on sapphire substrates with growth interruptions. The impurities accumulation is attributed to reaction of ammonia with the rector quartz ware during the growth interruptions. Because of this effect, HVPE-grown GaN layers had excessive Si and O concentration on the surface that may hamper forming of ohmic contacts especially in the case of p-type layers and may complicate homo-epitaxial growth of a device structure.
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Dislocation annihilation by silicon delta-doping in GaN epitaxy on Si
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Semi‐polar nitride surfaces and heterostructures
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