Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications

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Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

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Properties of lead-free solder alloys with rare earth element additions

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Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu

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Solder Joint Reliability—Theory and Applications

John H. Lau, Peter A. Engel · Journal of Electronic Packaging · 1992 · 262 citations · Full text

Engineering, Manufacturing Engineering, Fault Tolerance +9

Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity

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