Peng Sun

Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications

Cristina Andersson, Peng Sun, Johan Liu · Journal of Alloys and Compounds · 2007 · 58 citations

Materials Science, Engineering, Mechanical Engineering +6

High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization

Peng Sun, Cristina Andersson, Xicheng Wei et al. · Journal of Alloys and Compounds · 2006 · 50 citations

Materials Science, Materials Engineering, Electrical Engineering +8

Intermetallic compound formation in Sn–Co–Cu, Sn–Ag–Cu and eutectic Sn–Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering

Peng Sun, Cristina Andersson, Xicheng Wei et al. · Materials Science and Engineering B · 2006 · 35 citations

Materials Engineering, Materials Science, Reflow Soldering +8

Effect of Temperature and Strain Rate on Dynamic Properties of Low Silicon TRIP Steel

Rong Tian, Lin Li, BC De Cooman et al. · Journal of Iron and Steel Research International · 2006 · 32 citations

Dynamic Properties, Engineering, Severe Plastic Deformation +7

Warpage reduction of package-on-package (PoP) module by material selection & process optimization

Peng Sun, V. C. K. Leung, Bin Xie et al. · 2008 · 28 citations

Engineering, Mechanical Engineering, Computer Architecture +18