Cristina Andersson

Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications

Cristina Andersson, Peng Sun, Johan Liu · Journal of Alloys and Compounds · 2007 · 58 citations

Materials Science, Engineering, Mechanical Engineering +6

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Chang Dong Zou, Yu Lai Gao, Bin Yang et al. · Journal of Electronic Materials · 2008 · 51 citations

Materials Science, Materials Engineering, Engineering +5

High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization

Peng Sun, Cristina Andersson, Xicheng Wei et al. · Journal of Alloys and Compounds · 2006 · 50 citations

Materials Science, Materials Engineering, Electrical Engineering +8

Thermodynamic assessment of the Sn-Co lead-free solder system

Libin Liu, Cristina Andersson, Johan Liu · Journal of Electronic Materials · 2004 · 47 citations

Materials Engineering, Materials Science, Thermodynamic Modelling +8

Intermetallic compound formation in Sn–Co–Cu, Sn–Ag–Cu and eutectic Sn–Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering

Peng Sun, Cristina Andersson, Xicheng Wei et al. · Materials Science and Engineering B · 2006 · 35 citations

Materials Engineering, Materials Science, Reflow Soldering +8