Intermetallic compound formation in Sn–Co–Cu, Sn–Ag–Cu and eutectic Sn–Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering

Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan, Johan Liu

Materials Science and Engineering B · 2006 · 35 citations · 27 references

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