Zhaonian Cheng

High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization

Peng Sun, Cristina Andersson, Xicheng Wei et al. · Journal of Alloys and Compounds · 2006 · 50 citations

Materials Science, Materials Engineering, Electrical Engineering +8

Intermetallic compound formation in Sn–Co–Cu, Sn–Ag–Cu and eutectic Sn–Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering

Peng Sun, Cristina Andersson, Xicheng Wei et al. · Materials Science and Engineering B · 2006 · 35 citations

Materials Engineering, Materials Science, Reflow Soldering +8

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

Cong Yue, Yan Zhang, Zhili Hu et al. · Microsystem Technologies · 2010 · 30 citations

Materials Engineering, Materials Science, Electrical Engineering +12

Study of interfacial reactions in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Peng Sun, Cristina Andersson, Xicheng Wei et al. · Journal of Alloys and Compounds · 2006 · 27 citations

Materials Engineering, Interfacial Reactions, Materials Science +8

Research of Underfill Delamination in Flip Chip by the J-Integral Method

Bulu Xu, Xia Cai, Weidong Huang et al. · Journal of Electronic Packaging · 2004 · 23 citations

Engineering, Underfill Delamination, Flip Chip Package +17