Reliability of AlN substrates and their solder joints in IGBT power modules

On the effect of power cycling stress on IGBT modules

P. Cova, F. Fantini · Microelectronics Reliability · 1998 · 82 citations · Full text

Engineering, Electrical Engineering, Microelectronics +11

Advanced IGBT modules for railway traction applications: Reliability testing

H. Berg, E. Wolfgang · Microelectronics Reliability · 1998 · 63 citations

Engineering, Electrical Engineering, Electronic Materials +13

Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications

A. Hamidi, G. Coquery, R. Lallemand et al. · Microelectronics Reliability · 1998 · 40 citations

Engineering, Electrical Engineering, Materials Science +17

The thermal impedance of new power semiconductor modules using AlN substrates

G. Mitić, K. Sommer, D. Dieci et al. · 2002 · 11 citations

Engineering, Electrical Engineering, Materials Science +17