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Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications

Electrical EngineeringReliability EngineeringEngineeringReliability InvestigationsTemperature MeasurementsPower DeviceHardware ReliabilityCircuit ReliabilityThermal ModelingElectronic PackagingHeat TransferPower ElectronicsThermal EngineeringPhysic Of FailureDevice Reliability