Concepedia

Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications

A. Hamidi, G. Coquery, R. Lallemand, P. Vales, J.M. Dorkel

Microelectronics Reliability · 1998 · 40 citations · 3 references

DOI

Concepts

References

3

Reliability testing and analysis of IGBT power semiconductor modules

P. Jacob · 1995 · 68 citations

, , +15

Three-dimensional thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits

J.M. Dorkel, P. Tounsi, P. Leturcq · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1996 · 41 citations

, , +17

Effects of current density and chip temperature distribution on lifetime of high power IGBT modules in traction working conditions

A. Hamidi, G. Coquery · Microelectronics Reliability · 1997 · 19 citations

, , +16