Observer based temperature control for reduced thermal cycling in power electronic cooling

Selected failure mechanisms of modern power modules

Mauro Ciappa · Microelectronics Reliability · 2002 · 955 citations

Reliability, Electrical Engineering, Reliability Engineering +6

Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling

Vanessa Smet, F. Forest, J.-J. Huselstein et al. · IEEE Transactions on Industrial Electronics · 2011 · 580 citations

Engineering, Igbt Modules, Power Electronic Systems +16

Active thermal control of power electronic modules

D.A. Murdock, J.E. Torres, John J. Connors et al. · IEEE Transactions on Industry Applications · 2006 · 313 citations · Full text

Power Electronic Modules, Engineering, Active Thermal Control +18

Reliability of power cycling for igbt power semiconductor modules

Akira Morozumi, Kodai Yamada, Toru MIYASAKA et al. · IEEE Transactions on Industry Applications · 2003 · 244 citations

Engineering, Lead-based Solder, Mechanical Engineering +16

Compact Modeling of MOSFET Wearout Mechanisms for Circuit-Reliability Simulation

Xiaojun Li, Jin Qin, J.B. Bernstein · IEEE Transactions on Device and Materials Reliability · 2008 · 169 citations

Reliability, Device Modeling, Electrical Engineering +14