Concepedia

Akira Morozumi

AM

5

Publications

348

Citations

5

H-Index

2002

Active since

Affiliations

Fuji Electric (Japan)(Current)

Akira Morozumi is an author at Fuji Electric (Japan) specializing in engineering, electrical engineering, and electronic packaging.

Top concepts

EngineeringElectrical EngineeringElectronic PackagingCorrosionMaterial SciencePower ElectronicsMaterials EngineeringMechanical EngineeringReliabilityHeat Transfer

Publications per year

2002–2015

5

Publications

5

Reliability of power cycling for igbt power semiconductor modules

Akira Morozumi, Kodai Yamada, Toru MIYASAKA et al. · IEEE Transactions on Industry Applications · 2003 · 244 citations

Engineering, Lead-based Solder, Mechanical Engineering +16

Reliability of power cycling for IGBT power semiconductor modules

Akira Morozumi, Kodai Yamada, Toru MIYASAKA et al. · 2002 · 39 citations

Engineering, Lead-based Solder, Mechanical Engineering +17

Direct liquid cooling module with high reliability solder joining technology for automotive applications

Akira Morozumi, Hiroaki Hokazono, Yoshitaka Nishimura et al. · 2013 · 31 citations

Engineering, Liquid Metal Cooling, Energy Efficiency +18

Influence of Antimony on Reliability of Solder Joints Using Sn-Sb Binary Alloy for Power Semiconductor Modules

Akira Morozumi, Hiroaki Hokazono, Yoshitaka Nishimura et al. · Transactions of The Japan Institute of Electronics Packaging · 2015 · 23 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +14

Novel IGBT module design, material and reliability technology for 175&#x00B0;C continuous operation

Takashi Saito, Yoshitaka Nishimura, Fumihiko Momose et al. · 2014 · 11 citations

New Technologies, Engineering, Energy Efficiency +16

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