Hiroaki Hokazono

Direct liquid cooling module with high reliability solder joining technology for automotive applications

Akira Morozumi, Hiroaki Hokazono, Yoshitaka Nishimura et al. · 2013 · 31 citations

Engineering, Liquid Metal Cooling, Energy Efficiency +18

Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders

Xu Zhao, Masumi SAKA, Mikio MURAOKA et al. · Journal of Electronic Materials · 2014 · 29 citations

Materials Engineering, Materials Science, Electrical Engineering +12

A study of the bonding-wire reliability on the chip surface electrode in IGBT

Yoshinan Ikeda, Hiroaki Hokazono, Shigeru Sakaf et al. · International Symposium on Power Semiconductor Devices and IC's · 2010 · 23 citations

Engineering, Igbt Module, Advanced Packaging (Semiconductors) +17

Influence of Antimony on Reliability of Solder Joints Using Sn-Sb Binary Alloy for Power Semiconductor Modules

Akira Morozumi, Hiroaki Hokazono, Yoshitaka Nishimura et al. · Transactions of The Japan Institute of Electronics Packaging · 2015 · 23 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +14

The effect of adding Ni and Ge microelements on the electromigration resistance of low-Ag based SnAgCu solder

Xu Zhao, M. Saka, Hiroaki Hokazono · Microsystem Technologies · 2012 · 21 citations

Materials Engineering, Materials Science, Electrical Engineering +9