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Materials Science and Technology — A Comprehensive Treatment

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Materials Science, Materials Engineering, Engineering +3

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R. Boudreau · IEEE Transactions on Advanced Packaging · 2001 · 519 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +8

Cu/Sn interfacial reactions: thin-film case versus bulk case

K. N. Tu · Materials Chemistry and Physics · 1996 · 175 citations

Materials Science, Material Analysis, Engineering +4

Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

Y.C. Chan, A.C.K. So, J.K.L. Lai · Materials Science and Engineering B · 1998 · 164 citations

Materials Science, Friction Welding, Engineering +7

Interface reaction between copper and molten tin–lead solders

K. H. Prakash, Thirumany Sritharan · Acta Materialia · 2001 · 158 citations

Materials Science, Engineering, Interface Reaction +3