2010 · 12 citations · 21 references
EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesComplementary Metal-oxide-semiconductor TechnologyDevice ModelingDevice SimulationIntegrated Circuit DesignLeakage Power ReductionMetal-oxide-semiconductor Field-effect TransistorsGate LeakageGate Leakage CurrentGate Oxide LeakageGate Oxide Thickness EffectsHigh PerformanceHigh-k DielectricsLeakageMetal Gates
Bulk MOSFET is reaching to its physical limit with the advancement of technology. The key factor which influences the performance of bulk MOSFET in nano regime is the gate oxide thickness. In this work an attempt has been made to analyze the underlap FinFET structure using 2D simulation. ITRS 2009 high performance (HP) updates for the year of 2015 is used in this work. Study of n-type underlap FinFET structure is carried out to analyze the effects of metal gate with high-k dielectric. Use of high-k dielectrics with metal gate at a given EOT can improve the gate leakage current without harming the device performance. Underlap structure provides an improvement in the off-state leakage current than the overlap structure. Effects of gate workfuction variation on the performance of underlap FinFET structure is also studied in this paper.
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FinFET-a self-aligned double-gate MOSFET scalable to 20 nm
Chenming Hu, Jeffrey Bokor, Tsu‐Jae King et al. · IEEE Transactions on Electron Devices · 2000 · 1.6K citations
Engineering, Electrical Engineering, Electronic Materials +13
FinFET scaling to 10 nm gate length
Bin Yu, Leland Chang, Safayet Ahmed et al. · 2003 · 595 citations
E. Nowak, I. Aller, Thomas Ludwig et al. · IEEE Circuits and Devices Magazine · 2004 · 387 citations
Engineering, Computer Engineering, Electrical Engineering +17
Xuejue Huang, Wen‐Chin Lee, C. Kuo et al. · 2003 · 369 citations