IEEE Electron Device Letters · 2000 · 41 citations · 14 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsPower ElectronicsSemiconductor DevicesSemiconductor Device MaterialsSilicon MaterialsWide-bandgap Semiconductor DevicesContact ResistanceInversion Layer FormationPower MosfetsSheet ResistanceSilicon Carbide (Sic) MaterialsSilicon Carbide Power Devices
High-voltage lateral RESURF MOSFETs have been fabricated on 4H-SiC with both nitrogen and phosphorus as source/drain and RESURF region implants. Blocking voltages as high as 1200 V and specific on-resistances of 4 /spl Omega/ cm/sup 2/ have been obtained, with the high on-resistance attributed to poor inversion layer mobility. Phosphorus is most appropriate for the source/drain implants due to low sheet resistance and contact resistance with low temperature anneals. However, poor activation of low dose phosphorus implants at 1200/spl deg/C makes nitrogen the preferred choice for the RESURF region.
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High voltage thin layer devices (RESURF devices)
J.A. Appels, H.M.J. Vaes · 1979 · 520 citations
2.6 kV 4H-SiC lateral DMOSFETs
J. Spitz, M. R. Melloch, James A. Cooper et al. · IEEE Electron Device Letters · 1998 · 133 citations
Anant Agarwal, Jeff B. Casady, L.B. Rowland et al. · IEEE Electron Device Letters · 1997 · 125 citations