EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesSemiconductor MaterialsComplementary Metal-oxide-semiconductor TechnologyCurrent-voltage CharacteristicsDevice CharacterizationDevice ModelingMetal-oxide-semiconductor Field-effect TransistorsOxide SemiconductorsCurrentsFabricationGate Oxide InterfacesGate Oxide Thickness EffectsGate OxidesGate-dependent Current-voltage BehaviorHot Carrier InjectionPolysilicon
Graded-Gate-Oxide(GGO)-MOSFETs with various degrees of gate-drain(source) overlap (and grading thickness of the gate oxide near the polysilicon-gate edge) have been investigated for hot-electron generation. Compared with a conventional MOSFET, the GGO-MOSFET exhibits higher substrate and gate currents when the gate voltage is raised above a critical value(Vgc). Vgc is found to be dependent on the drain voltage. It is also a smooth function of the degree of gate-drain(source) overlap which can be controlled by the fabrication process. These experimental findings are supported by results obtained from the two-dimensional analysis of a similar device structure. Implications of the GGO phenomena on MOS technologies are discussed. Possible use of the GGO-MOSFET in EPROM is proposed.
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Titanium disilicide self-aligned source/drain + gate technology
C. K. Lau, Y.C. See, D.B. Scott et al. · 1982 · 100 citations
EPROM Cell with high gate injection efficiency
M. Kamiya, Y. Kojima, Yasuyuki Kato et al. · 1982 · 31 citations