Journal of Applied Physics · 1990 · 13 citations · 19 references
Materials ScienceMaterials EngineeringElectrical EngineeringIon ImplantationEngineeringEpitaxial GrowthApplied PhysicsDamage EnergyDefect FormationTrim CodeNuclear Energy LossMolecular Beam EpitaxyMicroelectronicsAmorphous SolidSolid-phase Epitaxial GrowthMicrostructure
The amorphization and recrystallization of tin-ion-implanted gallium arsenide were studied by cross-sectional transmission electron microscopy. Amorphization occurred in the sample implanted at a dose of 1014 ions/cm2. The interface between the amorphous region and the crystalline matrix is not flat. The amorphous region recrystallizes epitaxially with microtwin formation at 673 K. The amorphous-crystalline interface in the sample implanted at a dose of 1016 ions/cm2 is flat. In the deep region of this sample a solid-phase epitaxial growth without microtwin formation is observed after annealing at 673 K. These structural changes were compared with the nuclear energy loss (damage energy) distribution simulated by the trim code. It is concluded that the amorphization of the sample implanted at a dose of 1014 ions/cm2 is induced by the accumulation of damage energy; on the other hand, the amorphization of the sample implanted at a dose of 1016 ions/cm2 cannot be explained only by this process. The contribution of stress at the amorphous-crystalline interface is suggested.
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Attenuation lengths of low-energy electrons in solids
C. J. Powell · Surface Science · 1974 · 731 citations
Diffusion in Compound Semiconductors
B. Goldstein · Physical Review · 1961 · 219 citations
Semiconductors, Ii-vi Semiconductor, Electrical Engineering +13