Novel wire bond material for advanced power module packages

SKiN: Double side sintering technology for new packages

T. Stockmeier, Peter Beckedahl, Christian Gobl et al. · 2011 · 91 citations

Engineering, Electrical Engineering, Materials Science +17

Separating Failure Modes in Power Cycling Tests

Ralf Schmidt, Uwe Scheuermann · 2012 7th International Conference on Integrated Power Electronics Systems (CIPS) · 2012 · 53 citations

Engineering, Materials Engineering, Materials Science +17

The Road to the Next Generation Power Module - 100% Solder Free Design

Uwe Scheuermann, Peter Beckedahl · 2008 · 39 citations

Engineering, Electrical Engineering, Materials Engineering +17