Concepedia

Peter Beckedahl

PB

Statistics

Publications

5

Citations

181

H-Index

5

Active since

2008

Affiliations

Semikron (Germany)(Current)

Peter Beckedahl is an author at Semikron (Germany) specializing in electronic packaging, microelectronics, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringPower ElectronicsMaterial ScienceComputer EngineeringMechanical EngineeringSintering3D Printing

Publications per year

2008–2017

5

Publications

5

SKiN: Double side sintering technology for new packages

T. Stockmeier, Peter Beckedahl, Christian Gobl et al. · 2011 · 91 citations

Engineering, Double Side, Mechanical Engineering +20

The Road to the Next Generation Power Module - 100% Solder Free Design

Uwe Scheuermann, Peter Beckedahl · 2008 · 39 citations

Industrial Design, Electrical Engineering, Engineering +14

400 A, 1200 V SiC power module with 1nH commutation inductance

Peter Beckedahl, Sven Buetow, Andreas Maul et al. · 2016 · 25 citations

Sic Mosfet, Electrical Engineering, Engineering +9

High efficient approach to utilize SiC MOSFET potential in power modules

I. Kasko, S.E. Berberich, Michael J. Gross et al. · 2017 · 15 citations

Engineering, Power Electronics Converter, Power Modules +18

Novel packaging technology for power modules

Norbert Pluschke, Peter Beckedahl · 2012 · 11 citations

Engineering, Power Electronics, Interconnect (Integrated Circuits) +16

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