T. Stockmeier

SKiN: Double side sintering technology for new packages

T. Stockmeier, Peter Beckedahl, Christian Gobl et al. · 2011 · 91 citations

Engineering, Double Side, Mechanical Engineering +20

From Packaging to "Un"-Packaging - Trends in Power Semiconductor Modules

T. Stockmeier · 2008 · 57 citations

Engineering, Energy Efficiency, Power Circuit +19

Physical properties of semi-insulating polycrystalline silicon. I. Structure, electronic properties, and electrical conductivity

P. Brüesch, T. Stockmeier, F. Stucki et al. · Journal of Applied Physics · 1993 · 56 citations · Full text

Engineering, Electronic Properties, Silicon On Insulator +18

Design aspects of MOS-controlled thyristor elements: technology, simulation, and experimental results

F. Bauer, E. Halder, K.R. Hofmann et al. · IEEE Transactions on Electron Devices · 1991 · 38 citations

Engineering, Design Aspects, Integrated Circuits +18

Static and dynamic characteristics of high voltage ( 3.5 kV ) IGBT and MCT devices

F. Bauer, T. Stockmeier, H. Lendenmann et al. · 2005 · 26 citations

Electrical Engineering, Semiconductor Device, Engineering +12