Concepedia

Power Electronics Packaging

Power Electronics Packaging is a power electronics integration methodology that specifically encompasses the structural design, thermal management, electrical interconnection, and mechanical protection of semiconductor devices and passive components within electric vehicle skateboard platforms, distinguishing it from other power electronics development stages by its focus on physical implementation and system-level reliability.

349

Publications

13.6K

Citations

1.1K

Authors

276

Institutions

Publications per year

2017–2026

117

Parents

Publications

349

Flywheel batteries come around again

Robert Hebner, J.H. Beno, Alan Walls · IEEE Spectrum · 2002 · 386 citations

, , +17

Automotive Traction Inverters: Current Status and Future Trends

John Reimers, Lea Dorn-Gomba, Christopher Mak et al. · IEEE Transactions on Vehicular Technology · 2019 · 346 citations

, , +17

Review of Integrated Magnetics for Power Supply on Chip (PwrSoC)

Cian Ó Mathúna, Ningning Wang, Santosh Kulkarni et al. · IEEE Transactions on Power Electronics · 2012 · 311 citations

, , +17

On a Future for Power Electronics

J.D. van Wyk, Fred C. Lee · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2013 · 255 citations

, , +16

Prospects for SiC electronics and sensors

Alton B. Horsfall, Konstantin Vassilevski · Materials Today · 2008 · 237 citations · Full text

, , +12

1–5 of 349

Authors

1.1K

  1. GL
    Guo‐Quan Lu

    Virginia Tech, United States

    31 publications · 1.4K citations

    23

    h-index

  2. YM
    Yunhui Mei

    Tianjin University, China

    12 publications · 551 citations

    12

    h-index

  3. ZL
    Zhenxian Liang

    Oak Ridge National Laboratory, United States

    10 publications · 336 citations

    10

    h-index

  4. CM
    C. Mark Johnson

    University of Nottingham, United Kingdom

    9 publications · 247 citations

    9

    h-index

  5. JV
    J.D. van Wyk

    Virginia Tech, United States

    8 publications · 600 citations

    8

    h-index

1–5 of 1.1K

Institutions

276

  1. Virginia Tech

    Blacksburg, United States

    25 h-index

    141 publications

    5.8K citations

  2. Tianjin University

    Tianjin, China

    15 h-index

    44 publications

    2.6K citations

  3. University of Arkansas at Fayetteville

    Fayetteville, United States

    12 h-index

    41 publications

    1.3K citations

  4. Delft University of Technology

    Delft, The Netherlands

    11 h-index

    35 publications

    1.3K citations

  5. Georgia Institute of Technology

    Atlanta, United States

    10 h-index

    33 publications

    939 citations

  6. Oak Ridge National Laboratory

    Oak Ridge, United States

    9 h-index

    21 publications

    644 citations

  7. DEVCOM Army Research Laboratory

    Adelphi, United States

    8 h-index

    17 publications

    361 citations

  8. ABB (Switzerland)

    Zurich, Switzerland

    8 h-index

    23 publications

    1.1K citations

1–8 of 276

Venues

  1. IEEE Transactions on Power Electronics

    21 publications · 1.3K citations

    17

    h-index

  2. Microelectronics Reliability

    12 publications · 598 citations

    12

    h-index

  3. 12

    h-index

  4. 9

    h-index

  5. IEEE Transactions on Advanced Packaging

    8 publications · 407 citations

    8

    h-index

1–5