Concepedia

Power Module Packaging

Power Module Packaging is a specialized engineering framework within power electronics that integrates semiconductor devices, electrical interconnects, and thermal management components into a compact, reliable unit designed to optimize electrical performance, thermal dissipation, and mechanical robustness in hybrid vehicle applications.

331

Publications

11.4K

Citations

1.1K

Authors

236

Institutions

Publications per year

2017–2026

120

Parents

Publications

331

A High-Density, High-Efficiency, Isolated On-Board Vehicle Battery Charger Utilizing Silicon Carbide Power Devices

Bret Whitaker, Adam Barkley, Zach Cole et al. · IEEE Transactions on Power Electronics · 2013 · 422 citations

, , +17

Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device

Borong Hu, Jose Ortiz Gonzalez, Li Ran et al. · IEEE Transactions on Device and Materials Reliability · 2017 · 195 citations

, , +17

Automotive Power Module Packaging: Current Status and Future Trends

Yuhang Yang, Lea Dorn-Gomba, Romina Rodriguez et al. · IEEE Access · 2020 · 184 citations · Full text

, , +16

Review of Packaging Schemes for Power Module

Fengze Hou, Wenbo Wang, Liqiang Cao et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 146 citations · Full text

, , +17

Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging

Xiangdong Liu, Hiroshi Nishikawa · Scripta Materialia · 2016 · 144 citations

, , +16

1–5 of 331

Authors

1.1K

  1. GL
    Guo‐Quan Lu

    Virginia Tech, United States

    23 publications · 833 citations

    17

    h-index

  2. FW
    Fred Wang

    University of Tennessee at Knoxville, United States

    13 publications · 458 citations

    12

    h-index

  3. ZL
    Zhenxian Liang

    Oak Ridge National Laboratory, United States

    14 publications · 559 citations

    12

    h-index

  4. PN
    Puqi Ning

    Chinese Academy of Sciences, China

    14 publications · 632 citations

    12

    h-index

  5. DB
    Dushan Boroyevich

    Virginia Tech, United States

    11 publications · 679 citations

    11

    h-index

1–5 of 1.1K

Institutions

236

  1. Virginia Tech

    Blacksburg, United States

    25 h-index

    127 publications

    5.4K citations

  2. University of Arkansas at Fayetteville

    Fayetteville, United States

    19 h-index

    96 publications

    2.7K citations

  3. Oak Ridge National Laboratory

    Oak Ridge, United States

    16 h-index

    48 publications

    1.9K citations

  4. University of Tennessee at Knoxville

    Knoxville, United States

    14 h-index

    27 publications

    1.3K citations

  5. ABB (Switzerland)

    Zurich, Switzerland

    12 h-index

    56 publications

    1.6K citations

  6. National Transportation Research Center

    Knoxville, United States

    12 h-index

    33 publications

    1.2K citations

  7. Tianjin University

    Tianjin, China

    12 h-index

    46 publications

    1.6K citations

  8. Xi'an Jiaotong University

    Xi'an, China

    10 h-index

    68 publications

    3.1K citations

1–8 of 236

Venues

  1. IEEE Transactions on Power Electronics

    44 publications · 2.6K citations

    29

    h-index

  2. Microelectronics Reliability

    13 publications · 540 citations

    13

    h-index

  3. 12

    h-index

  4. 7

    h-index

  5. IEEE Transactions on Industry Applications

    6 publications · 249 citations

    6

    h-index

1–5