Automotive Power Module Packaging: Current Status and Future Trends

TLDR

Semiconductor power modules are core components of power electronics in electrified vehicles, and packaging technology critically affects their performance and reliability, with most modules already applied in commercial vehicles. This paper reviews automotive power module packaging technologies comprehensively. The review covers driving factors, design considerations, component structures, and innovative features of state‑of‑the‑art automotive power modules, and categorizes promising trends such as PCB‑embedded, 3‑D, press‑pack packaging, and advanced materials. The review concludes that combining multiple packaging technologies can yield superior overall performance, though each trend has its own advantages and drawbacks.

Abstract

Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies.