Bell Labs Technical Journal · 2005 · 53 citations · 4 references
EngineeringElectrical EngineeringMicroelectromechanical SystemsMicroelectronicsMicrofabricationMems FabricationMems PackagingMems ReliabilityMicrowave PackagingRadio-frequency Integrated CircuitsRf MemsMems Device PackagingRf Mems FabricationRf Mems FiltersRf Mems PackagingRf Mems ReliabilityRf Mems SwitchesSoftware Defined RadioWafer-level Packaging
Will RF MEMS deliver on its promise to be one of the major MEMS businesses in the future? RF MEMS has now entered its second generation; high-volume production of both contacting and non-contacting switches and filters (based on bulk acoustic waves) was ramped up worldwide starting in 2003. In first-generation RF MEMS, discrete components were developed to demonstrate RF performance and reliability, and low-cost, high-volume chip- and wafer-scale packaging eliminated the final barriers to high-volume production of discrete replacement components with MEMS. In this paper, we review the RF MEMS industry and the commercialization status of RF MEMS components. We also provide a detailed case study of mobile telephone basestations, demonstrating how RF MEMS can impact telecommunications. Finally, we look at research into third-generation RF MEMS and NEMS, in which integration, active devices, and new functionality will create opportunities for disruptive changes in RF subsystems, enabling such things as software-defined radio.
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