Rf Mems Packaging

RF MEMS Packaging is a specialized encapsulation methodology that integrates radio-frequency micro-electromechanical systems into protective, functional, and environmentally stable housings while preserving their high-frequency performance and mechanical integrity.

162

Publications

5.7K

Citations

604

Authors

148

Institutions

Publications per year

2017–2026

10

Parents

Authors

604

  1. HT
    H.A.C. Tilmans

    IMEC, Belgium

    13 publications · 684 citations

    11

    h-index

  2. AJ
    Anne Jourdain

    IMEC, Belgium

    11 publications · 603 citations

    11

    h-index

  3. JI
    Jacopo Iannacci

    Fondazione Bruno Kessler, Italy

    8 publications · 227 citations

    8

    h-index

  4. LK
    L.P.B. Katehi

    University of Michigan, United States

    8 publications · 353 citations

    8

    h-index

  5. JP
    John Papapolymerou

    Georgia Institute of Technology, United States

    6 publications · 228 citations

    6

    h-index

1–5 of 604

Venues

  1. 11

    h-index

  2. Microsystem Technologies

    7 publications · 135 citations

    7

    h-index

  3. Journal of Micromechanics and Microengineering

    JMM · 7 publications · 404 citations

    7

    h-index

  4. Journal of Microelectromechanical Systems

    6 publications · 218 citations

    6

    h-index

  5. Sensors and Actuators A Physical

    5 publications · 119 citations

    5

    h-index

1–5