Characteristics of a new-type anisotropic conductive film joints during the bonding process

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 117 citations

Engineering, Materials Engineering, Materials Science +17

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 113 citations

Engineering, Materials Engineering, Materials Science +13

Flow characterization and thermo-mechanical response of anisotropic conductive films

R. Dudek, S. Meinel, Andreas Schubert et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 48 citations

Engineering, Materials Engineering, Materials Science +17

Thermal stability performance of anisotropic conductive film at different bonding temperatures

S. C. Tan, Y.C. Chan, Y.W. Chiu et al. · Microelectronics Reliability · 2003 · 32 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effects of Solder Reflow on the Reliability of Flip-Chip on Flex Interconnections Using Anisotropic Conductive Adhesives

Chunyan Yin, C. Bailey, Yin‐Ching Chan · IEEE Transactions on Electronics Packaging Manufacturing · 2004 · 30 citations

Engineering, Materials Engineering, Materials Science +17