S. C. Tan

Thermal stability performance of anisotropic conductive film at different bonding temperatures

S. C. Tan, Y.C. Chan, Y.W. Chiu et al. · Microelectronics Reliability · 2003 · 32 citations

Materials Science, Engineering, Different Bonding Temperatures +13

Perforin‐Mimicking Molecular Drillings Enable Macroporous Hollow Lignin Spheres for Performance‐Configurable Materials

Hairong Wang, S. C. Tan, Zhenhua Su et al. · Advanced Materials · 2024 · 30 citations

Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages

Y.C. Chan, S. C. Tan, Nelson S. M. Lui et al. · IEEE Transactions on Advanced Packaging · 2007 · 22 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +17

Surface Treatment of Polyethylene Terephthalate (PET) Film for Lamination of Flexible Photovoltaic Devices

C.S. Goh, S. C. Tan, S.L. Ngoh et al. · Energy Procedia · 2012 · 14 citations · Full text

Engineering, Organic Solar Cell, Chemistry +24

The effect of different bonding temperatures on the mechanical and electrical performance of NCF-bonded flip-chip-on-flex packages

S. C. Tan, Y.C. Chan, Nelson S. M. Lui · IEEE Transactions on Advanced Packaging · 2006 · 13 citations

Ncf-bonded Flip-chip-on-flex Packages, Engineering, Mechanical Engineering +20