Nelson S. M. Lui

Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages

Y.C. Chan, S. C. Tan, Nelson S. M. Lui et al. · IEEE Transactions on Advanced Packaging · 2007 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +14

The effect of different bonding temperatures on the mechanical and electrical performance of NCF-bonded flip-chip-on-flex packages

S. C. Tan, Y.C. Chan, Nelson S. M. Lui · IEEE Transactions on Advanced Packaging · 2006 · 13 citations

Engineering, Materials Engineering, Materials Science +17

Process optimization to overcome void formation in nonconductive paste interconnections for fine-pitch applications

S. C. Tan, Y. C. Chan, Nelson S. M. Lui · Journal of Electronic Materials · 2005 · 12 citations

Engineering, Materials Engineering, Materials Science +13

Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages

Y.C. Chan, S. C. Tan, Nelson S. M. Lui et al. · IEEE Transactions on Advanced Packaging · 2006 · 12 citations

Natural Sciences, Materials Engineering, Materials Science +14