Applied Physics Letters · 2009 · 23 citations · 12 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDopingIntegrated Circuit DevicesSemiconductor Device MaterialsSemiconductor InterfacesSemiconductor PhysicsSilicon MaterialsCurrent DensityDifferential ResistanceJunction ResistanceMolecular Beam EpitaxyP-n Junction CharacteristicsSemiconductor Doping ProfilesSiliconSilicon Doping
We report room temperature current voltage characteristics of Si p+-i-n+ Esaki diodes integrated on silicon substrates. The diodes were fabricated by low-temperature molecular beam epitaxy. Very high and abrupt p- and n-type dopant transitions into the 1020 cm−3 ranges are achieved by boron and antimony, respectively. The integrated devices are realized without a postgrowth annealing step. The silicon Esaki diodes show negative differential resistance at room temperature with excellent peak to valley current ratios up to 3.94. A variation in the thickness of the silicon tunneling barrier changes the peak current density over three orders of magnitude.
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Resonant tunneling through quantum wells at frequencies up to 2.5 THz
T. C. L. G. Sollner, W. D. Goodhue, P. E. Tannenwald et al. · Applied Physics Letters · 1983 · 1.1K citations · Full text
Germanium waveguide photodetectors integrated on silicon with MBE
Michael Oehme, J.H. Werner, Mathias Kaschel et al. · Thin Solid Films · 2008 · 70 citations