Influence of Oxygen Concentration on Resistance Switching Characteristics of Gallium Oxide

Jheng-Jie Huang, Ting‐Chang Chang, Jyun-Bao Yang, Shih-Ching Chen, Po‐Chun Yang, Yuting Chen, Hsueh-Chih Tseng, Simon M. Sze, Ann‐Kuo Chu, Ming‐Jinn Tsai

IEEE Electron Device Letters · 2012 · 39 citations · 19 references

Concepts

Abstract

In this letter, we fabricated resistance random access memory in a Pt/GaOx/TiN structure with a bipolar resistance switching characteristic and a bistable resistance ratio of about two orders by <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">I</i> - <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i> sweeping. In order to increase the oxygen ion quantity in the gallium oxide layer, the proposed sample was sputtered in a mixed ambient of Ar and oxygen, and the resistance ratio was enhanced by 2.5 orders. In addition to the resistance ratio, set voltage distribution statistics show that the stability of gallium oxide sputtered in mixed Ar and oxygen gas was better than standard Ar-only sample.

References

19