Low Temperature Consolidation of Micro/Nanosilver Die-Attach Preforms

High-temperature electronics - a role for wide bandgap semiconductors?

Philip G. Neudeck, Robert S. Okojie, Liang-Yü Chen · Proceedings of the IEEE · 2002 · 987 citations

Semiconductors, Wide-bandgap Semiconductor, Electrical Engineering +14

Random Packing of Equal and Unequal Spheres in Two and Three Dimensions

William M. Visscher, M. Bolsterli · Nature · 1972 · 490 citations

Discrete Geometry, Engineering, Physics +7

Study of particle rearrangement during powder compaction by the Discrete Element Method

Christophe Martín, D. Bouvard, Shin‐ichiro Shima · Journal of the Mechanics and Physics of Solids · 2003 · 321 citations

Materials Engineering, Materials Science, Engineering +11

Low-temperature low-pressure die attach with hybrid silver particle paste

Katsuaki Suganuma, S. Sakamoto, Noriko Kagami et al. · Microelectronics Reliability · 2011 · 278 citations

Materials Science, Materials Engineering, Engineering +6

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

Thomas G. Lei, Jesus N. Calata, Guo‐Quan Lu et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 233 citations

Low-temperature Sintering, Engineering, Low-temperature Sintering Technique +21