International Journal of Adhesion and Adhesives · 2011 · 30 citations · 26 references
Materials ScienceEngineeringDurability PerformanceAdhesive MaterialMechanical EngineeringThermal CyclingHygrothermal AgingAdhesive MaterialsShear StrengthThermoplastic CompositeThermomechanical AnalysisMechanics Of MaterialsStructural Adhesive
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Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 117 citations
Materials Science, Different Bonding Temperature, Flip-chip-on-flex Packages +10