Performance of W100−xNx diffusion barriers between 〈Si〉 and Cu

Diffusion barriers in thin films

M.−A. Nicolet · Thin Solid Films · 1978 · 681 citations

Materials Science, Engineering, Diffusion Resistance +5

Sputtered W–N diffusion barriers

H. Kattelus, E. Kolawa, K. Affolter et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1985 · 99 citations

Engineering, Thin Film Process Technology, Metal Overlayer +17

WNx: Properties and applications

Frank C. T. So, Elzbieta Kolawa, Xin-An Zhao et al. · Thin Solid Films · 1987 · 47 citations

Time-sensitive Networking, Engineering, Computer Engineering +2

W<i>x</i>N1−<i>x</i> alloys as diffusion barriers between Al and Si

F. C. T. So, E. Kolawa, X.‐A. Zhao et al. · Journal of Applied Physics · 1988 · 44 citations

Materials Science, Semiconductors, Diffusion Barriers +14

A comparison between aluminum and copper interactions with high-temperature oxide and nitride diffusion barriers

A. Charaı̈, Sven Erik Hörnström, P. M. Fryer et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1989 · 36 citations

Aluminium Nitride, Engineering, Oxidation Resistance +18