F. C. T. So - Concepedia

Author

F. C. T. So

California Institute of Technology

Also Known As

F. C. T. So, F.C.T. So, Francisco So

Publications

573

Citations

H-Index

Concepts

All Affiliations

California Institute of Technology

About

F. C. T. So is an author at California Institute of Technology specializing in applied physics, engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	10	497
2	Applied Physics	10	10	497
3	Materials Science	9	9	359
4	Materials Engineering	6	6	283
5	Electrical Engineering	2	2	151

F. C. T. So

Publications

529

Citations

H-Index

Page 1

	Year	Citations
An improved forward I-V method for nonideal Schottky diodes with high series resistance C.‐D. Lien, F. C. T. So, M.−A. Nicolet IEEE Transactions on Electron Devices Numerical AnalysisElectrical EngineeringNonideal Schottky DiodesCurve LnEngineering	1984	138
Reactively sputtered RuO2 diffusion barriers E. Kolawa, F. C. T. So, E. T-S. Pan, Applied Physics Letters EngineeringThin Film Process TechnologySemiconductorsMaterial PhysicEpitaxial Growth	1987	121
Reactive sputtering of RuO2 films E. Kolawa, F. C. T. So, W. Flick, Thin Solid Films Materials EngineeringMaterials ScienceEngineeringSurface ScienceApplied Physics	1989	62
W<i>x</i>N1−<i>x</i> alloys as diffusion barriers between Al and Si F. C. T. So, E. Kolawa, X.‐A. Zhao, Journal of Applied Physics Materials ScienceSemiconductorsDiffusion BarriersSemiconductor TechnologyEngineering	1988	44
TiAl3 formation by furnace annealing of Ti/Al bilayers and the effect of impurities X.‐A. Zhao, F. C. T. So, M.‐A. Nicolet Journal of Applied Physics Materials EngineeringMaterials ScienceAluminium NitrideMaterial AnalysisEngineering	1988	38
Microstructure of reactively sputtered oxide diffusion barriers E. Kolawa, C. W. Nieh, F. C. T. So, Journal of Electronic Materials Materials ScienceMaterials EngineeringMaterial AnalysisEngineeringDiffusion Resistance	1988	25
Microstructure of RuO2 layer as diffusion barrier between Al and Si substrate C. W. Nieh, E. Kolawa, F. C. T. So, Materials Letters Materials ScienceMaterials EngineeringSi SubstrateAluminium NitrideEngineering	1988	20
Amorphous NiNW film as a diffusion barrier between aluminum and silicon Min Zhu, F. C. T. So, M‐A. Nicolet Thin Solid Films	1985	19
Reactively Sputtered W‐N Films as Diffusion Barriers in GaAs Metallizations E. Kolawa, F. C. T. So, J. L. Tandon, Journal of The Electrochemical Society Materials ScienceSemiconductorsHigh Temperature MaterialsEngineeringSputtered W‐n Films	1987	19
Properties of reactively sputtered Mo1?x O x films F. C. T. So, E. Kolawa, Sen Nieh, Applied Physics A Materials EngineeringMaterials ScienceMaterial AnalysisEngineeringSurface Science	1988	17

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